Products
Discover our innovative thermal management solutions
ALVC Vapor Chamber
High-efficiency two-phase heat spreaders with lightweight aluminum construction. Designed for GPU, CPU, IGBT power electronics and energy storage systems.
Liquid Cold Plate (LCP)
Custom Liquid Cold Plates (LCP). We master all manufacturing types and advise you on the most efficient solution for your project.
Heat Sink
Extruded, milled, stacked and die-cast aluminum heat sinks with optional heat pipe integration – manufactured to drawing for power electronics, HPC and industrial drives.
Copper Heat Pipe Assembly
High-performance assembly integrating custom copper heat pipes, aluminum fins, and precision baseplates for rapid localized heat transfer.
Loop Thermosyphon Cooling System
Maintenance-free, passive two-phase cooling system without mechanical pumps. Enables zero-loss long-distance heat transport for remote thermal architectures.
Pulsating Heat Pipe
Novel phase-change technology utilizing oscillating capillary loops. Perfect for highly compact, high-density systems under dynamic thermal loads.
Heat Exchanger (Air-to-Air)
Passive Air-to-Air cooling (2–5 kW) for Industrial Edge and Smart Factory environments. Exceeds the physical 2 kW limits of standard sheet-metal heat exchangers.
Heat Exchanger (Air-to-Liquid)
Air-to-Water Heat Exchangers (5–12 kW) for direct integration into central chilled water loops — enabling EnEfG compliance (PUE ≤1.5) in colocation brownfield environments.
3DVC Vapor Chamber Heat Sink
Advanced three-dimensional vapor chamber heat sink combining horizontal and vertical two-phase cooling for ultra-high power densities in AI accelerators and power electronics.