High-Performance Computing & AI Hardware

3DVC (3D Vapor Chamber) & Liquid Cooling – High-efficiency thermal dissipation solutions for AI servers, GPU clusters, and High-Performance Computing (HPC). Integrated with Loop Heat Pipe (LHP) technology, ALVC delivers up to 2000W maximum heat dissipation per module with seamless compatibility for Intel EGS/BHS, AMD SP5/SP7, and NVIDIA H100/H200/B200 platforms.

Advantages of our 3DVC technology: Direct phase-change loop integration eliminates contact thermal resistance. The closed-loop system achieves an effective thermal conductivity of up to 10,000 W/(m·K) (approx. 25x better than pure copper), reliably preventing hardware throttling while remaining 30% smaller and 25% lighter than conventional heat sinks.