3DVC Vapor Chamber Heat Sink
Advanced 3D vapor chamber heat sinks for extreme heat flux densities. Combines vertical and horizontal two-phase cooling for AI accelerators and power electronics.
The ALVC 3DVC cooler is developed based on our patented ALVC aluminum composite. It adopts an intercommunicated layout to form an integrated 3D vacuum cavity, with cooling fins welded between individual cavity units — resulting in a hermetically sealed, compact assembly with maximum heat transfer surface.
This technology significantly reduces overall thermal resistance (Rth) by up to 45% compared to conventional heat sinks. Ideal for high-density architectures handling thermal loads exceeding 800 W in constrained spaces.
Specifications
- Cooling Principle
- 3D two-phase heat spreading (3D vacuum cavity)
- Technology
- ALVC base chamber + interconnected 3D vacuum cavity + welded aluminum cooling fins
- Materials
- ALVC Aluminum Composite (chamber + 3D cavities + fins)
- Working Fluid
- Acetone | Distilled water and others (application-dependent)
- Thermal Resistance (Rth)
- < 0.08 K/W (system dependent)
- Max Power (Qmax)
- Up to 2,000 W per processor module
- Operating Temperature
- -40 °C to +160 °C
- Applications
- AI Servers (H100/MI300X), IGBT Inverters, 5G RRU, Radar & Defense, HPC
Technology
- Standard Type: Flat ALVC base chamber with vertically welded 3D cavities and aluminum cooling fins. Proven for standard power modules and base stations.
- High-Power Type: Multiple parallel 3D chambers for extreme thermal densities. Direct die-attach compatible for AI accelerators (Nvidia H100, AMD MI300X) and IGBT traction inverters.
- Custom Shape Type: CNC-customized geometry for irregular power module layouts, power stage arrays, or asymmetric mounting in frequency converters and radar systems.
- Ultra-Thin Type: Minimum overall height for server blades and 1U/2U rack servers with severely constrained space. Full 3D thermal spreading is maintained.