3DVC Vapor Chamber Heat Sink
Advanced three-dimensional vapor chamber heat sink combining horizontal and vertical two-phase cooling for ultra-high power densities in AI accelerators and power electronics.
The ALVC 3DVC Vapor Chamber combines a flat base chamber seamlessly with vertical vapor pipes or cooling towers. This 3D phase-change loop absorbs thermal energy directly at the heat source and spreads it across the fin array without interface resistance.
This technology significantly reduces overall thermal resistance (Rth) by up to 45% compared to conventional heat sinks. Ideal for high-density architectures handling thermal loads exceeding 800 W in constrained spaces.
Specifications
- Thermal Spreading
- Full 3D conduction without internal thermal interface resistance
- Thermal Resistance (Rth)
- < 0.08 K/W (system dependent)
- Max Power (Qmax)
- Up to 1,200 W per processor module
- Operating Temperature
- -40 °C to +160 °C
- Construction
- Integral 3D Vapor Chamber with directly bonded aluminum/copper fins
- Applications
- AI Servers, Next-Gen GPUs/CPUs, Telecom & Radar