Data Center & Server Infrastructure Cooling

Surging rack densities and high-TDP accelerator cards pose critical thermal challenges for modern data centers. ALVC delivers high-efficiency Direct-to-Chip Liquid Cold Plates and hybrid 3DVC heat sinks that capture heat directly at the silicon die.

Deploying our phase-change and liquid cooling components significantly improves Data Center Power Usage Effectiveness (PUE) while cutting facility HVAC energy draw by up to 40%.