Data Center & IT Infrastructure
Comprehensive thermal management for modern data centers, colocation brownfield sites, and hyperscale facilities. ALVC supports operators in meeting strict energy efficiency regulations (like EnEfG) and significantly lowers PUE values through high-efficiency direct liquid cooling (LCP) and air-to-liquid rear-door heat exchangers (up to 35 kW) for retrofitting.
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ALVC Vapor Chamber
High-efficiency two-phase heat spreaders with lightweight aluminum construction. Designed for GPU, CPU, IGBT power electronics and energy storage systems.
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Liquid Cold Plate (LCP)
Custom Liquid Cold Plates (LCP). We master all manufacturing types and advise you on the most efficient solution for your project.
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Heat Sink
Extruded, milled, stacked and die-cast aluminum heat sinks with optional heat pipe integration – manufactured to drawing for power electronics, HPC and industrial drives.
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Copper Heat Pipe Assembly
High-performance assembly integrating custom copper heat pipes, aluminum fins, and precision baseplates for rapid localized heat transfer.
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