
Control Cabinets & IT‑Infrastructure
Surging rack densities and high-TDP AI accelerator cards (HPC) pose critical thermal challenges for modern data centers. Simultaneously, industrial server and control cabinets require hermetically separated cooling loops (IP55/IP65).
ALVC delivers a complete spectrum: From passive air-to-air heat exchangers for rugged control cabinets to high-efficiency Liquid Cold Plates (LCP) and 3D Vapor Chambers (3DVC) that capture heat directly at the silicon die. This lowers PUE and reliably prevents thermal throttling.
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ALVC Vapor Chamber
High-efficiency two-phase heat spreaders with lightweight aluminum construction. Designed for GPU, CPU, IGBT power electronics and energy storage systems.
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Liquid Cold Plate (LCP)
Custom Liquid Cold Plates (LCP). We master all manufacturing types and advise you on the most efficient solution for your project.
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Heat Sink
Extruded, milled, stacked and die-cast aluminum heat sinks with optional heat pipe integration – manufactured to drawing for power electronics, HPC and industrial drives.
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Copper Heat Pipe Assembly
High-performance assembly integrating custom copper heat pipes, aluminum fins, and precision baseplates for rapid localized heat transfer.
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