The ALVC Aluminum Vapor Chamber combines the extreme thermal conductivity of two-phase systems (5,000 to 10,000 W/(m·K)) with the ultra-low weight of aerospace-grade aluminum.

Compared to conventional copper vapor chambers, ALVC technology reduces weight by up to 60% with comparable heat spreading performance. This makes it the premier choice for automotive electronics, aerospace payloads, and high-density computing racks.

ALVC Aluminum Vapor Chamber Heat Spreader

ALVC Aluminum Vapor Chambers: up to 10,000 W/(m·K) thermal conductivity, 60% lighter than copper, FSW sealed. Request a quote today.

Aluminum Vapor Chamber | ALVC Europe

High-efficiency two-phase vapor chamber heat spreaders with lightweight aluminum construction. Designed for GPU, CPU, IGBT power electronics, and energy storage systems.

Liquid Cold Plates (LCP) form the backbone of modern direct liquid cooling in high-power applications: from server CPUs and AI accelerators to EV traction inverters and Battery Energy Storage Systems (BESS).

ALVC masters all five industrial manufacturing processes for liquid cold plates and provides independent technical consulting to ensure the optimal balance of thermal resistance, pressure drop, weight, and unit cost for your project.

Liquid Cold Plate (LCP)

Custom Liquid Cold Plates: FSW, Vacuum Brazing, Skived Fin, Deep Hole Drilled & Embedded Tube. Up to 35 kW cooling capacity. Request a quote.

Liquid Cold Plate (LCP) | ALVC Europe

Custom Liquid Cold Plates (LCP). We master all manufacturing types and advise you on the most efficient solution for your project.

ALVC manufactures custom aluminum heat sinks using all common production methods. From simple extruded profiles to high-performance skived-fin structures – we advise technology-independently and deliver the thermally and commercially optimal solution for your application.

All heat sinks are manufactured to customer drawings, with optional heat pipe integration (press-fit or soldered), surface treatment (anodizing, powder coating), and 100% helium leak testing for integrated heat pipe systems.

Custom Heat Sinks

Custom aluminum heat sinks: extruded, skived fin, CNC-milled, die-cast & bonded fin. Optional heat pipe integration. Request a quote.

Custom Aluminum Heat Sinks | ALVC Europe

Extruded, milled, stacked, and die-cast aluminum heat sinks with optional heat pipe integration – manufactured to drawing for power electronics, HPC, and industrial drives.

Copper Heat Pipe Assemblies exploit the exceptional thermal transport capability of sintered copper heat pipes to swiftly transfer concentrated heat from localized sources across an expanded fin matrix.

Featuring advanced sintered copper powder wicks, our heat pipes deliver reliable operation in any spatial orientation (even against gravity). We combine pipe diameters from 4mm to 12mm with high-density zipper-fin arrays and precision CNC baseplates.

Copper Heat Pipe Heat Sink Assembly

Copper heat pipe heat sinks by ALVC Europe: Custom assemblies with aluminum fin stacks for servers, power electronics, and telecom. Request quote.

Copper Heat Pipe Assemblies | ALVC Europe

High-performance assembly integrating custom copper heat pipes, aluminum fins (zipper/folded), and precision baseplates for rapid localized heat transfer.

Loop Thermosyphons utilize natural gravity-driven circulation of a working fluid within a closed-loop circuit. Vapor generated at the evaporator rises to an elevated condenser, releases its latent heat, and returns via gravity as liquid.

Operating entirely without mechanical pumps, the system generates zero vibration, consumes zero electrical pumping power, and has no moving parts to wear out. This delivers over 10 years of maintenance-free operation in remote infrastructures.

Loop Thermosyphon Cooling System

Loop Thermosyphon by ALVC Europe: Passive two-phase cooling without mechanical pumps for zero-maintenance operation in 5G, HPC & power electronics.

Loop Thermosyphon Cooling | ALVC Europe

Maintenance-free, passive two-phase cooling system without mechanical pumps. Enables zero-loss long-distance heat transport for remote thermal architectures.

Pulsating Heat Pipes (PHPs) represent an innovative leap beyond conventional heat pipe designs. A serpentine meandering capillary tube is partially filled with working fluid, naturally forming alternating liquid slugs and vapor bubbles.

Thermal input at the evaporator causes rapid bubble expansion that propels the entire fluid train into self-sustaining, high-frequency oscillations—transferring massive thermal loads without requiring porous internal wicks.

Pulsating Heat Pipe (PHP)

Pulsating Heat Pipes (PHP) by ALVC Europe: Oscillating two-phase capillary cooling for ultra-high heat flux and dynamic thermal cycles. Learn more.

Pulsating Heat Pipes (PHP) | ALVC Europe

Novel phase-change technology utilizing oscillating capillary loops. Perfect for highly compact, high-density systems under dynamic thermal loads.

Our Air-to-Air Heat Exchangers deliver up to 5 kW of passive cooling capacity in a compact footprint, surpassing the conventional 2 kW physical limitation of standard sheet-metal heat exchangers.

Both interior and exterior air loops are hermetically separated (IP55/IP65). Dust, airborne contaminants, and humidity remain strictly outside the control enclosure.

Heat Exchanger (Air-to-Air)

ALVC Air-to-Air Heat Exchangers: up to 5 kW passive cooling, IP55/65, 100% maintenance-free, no refrigerant. Ideal for control cabinets & Smart Factory.

Air-to-Air Heat Exchanger 2–5 kW | ALVC Europe

Passive Air-to-Air cooling (2–5 kW) for Industrial Edge and Smart Factory environments. Exceeds the physical 2 kW limits of standard sheet-metal heat exchangers.

Our Air-to-Water Heat Exchangers directly connect enclosure cooling loops to the facility chilled water system. Hot internal air is routed across copper-aluminum cores and removed via liquid coolant, enabling significant improvements to the Energy Reuse Factor (ERF) without costly white-space renovations.

Aligned with stringent energy efficiency regulations (EnEfG, EED), these systems provide the necessary liquid-cooling efficiency for brownfield data centers to meet mandatory PUE targets of ≤1.5 by 2027, avoiding the risk of piping water directly to the server racks.

Heat Exchanger (Air-to-Liquid)

ALVC Air-to-Liquid Heat Exchangers 5–12 kW: IP55/65, 100% maintenance-free, EnEfG-compliant. Direct tie-in to facility chilled water loops. Request a quote.

Air-to-Liquid Heat Exchanger | ALVC Europe

Air-to-Liquid Heat Exchangers (5–12 kW) for direct integration of server racks into facility chilled-water loops. Enables EnEfG compliance (PUE ≤1.5) in colocation brownfield.

3DVC (3D Vapor Chamber) technology represents the pinnacle of air-assisted phase-change thermal management. While conventional vapor chambers only spread heat two-dimensionally across the X-Y baseplate, 3DVC integrates vertical heat pipe columns directly into the unified hermetic vapor chamber cavity.

By eliminating contact thermal interface resistance between the base vapor chamber and vertical tubes, overall thermal resistance (Rth) drops by up to 35%. This enables reliable air cooling of high-TDP AI accelerators and server processors from 800W to over 1200W.

3DVC Vapor Chamber Heat Sink

3DVC heat sinks by ALVC Europe: Integrates horizontal and vertical vapor chamber technology for extreme TDPs exceeding 1000W. Learn more.

3DVC Vapor Chamber Heat Sink | ALVC Europe

Advanced three-dimensional vapor chamber heat sink combining horizontal and vertical two-phase cooling for ultra-high power densities in AI accelerators and power electronics.

Surging rack densities and high-TDP AI accelerator cards (HPC) pose critical thermal challenges for modern data centers. Simultaneously, industrial server and control cabinets require hermetically separated cooling loops (IP55/IP65).

ALVC delivers a complete spectrum: From passive air-to-air heat exchangers for rugged control cabinets to high-efficiency Liquid Cold Plates (LCP) and 3D Vapor Chambers (3DVC) that capture heat directly at the silicon die. This lowers PUE and reliably prevents thermal throttling.