Liquid Cold Plate (LCP)
High-performance Liquid Cold Plates (LCP) with optimized internal micro-channel and pin-fin geometries. Engineered for direct liquid cooling of CPUs, power electronics, and high-current battery systems.
The ALVC Liquid Cold Plate (LCP) delivers tailored direct liquid cooling for high-power density applications. Featuring precision vacuum-brazed or Friction Stir Welded (FSW) internal micro-channels, coolant flows directly beneath thermal hotspots for optimum heat extraction.
Our LCP architectures guarantee zero-leakage reliability, high corrosion resistance, and low pressure drops. Seamlessly integrable into server liquid loops, electric vehicle powertrains, and energy storage cooling circuits.
Specifications
- Technology
- Micro-Channel & Pin-Fin Internal Structure (Vacuum Brazing / FSW)
- Materials
- High-purity Aluminum (Al-6063/6061) or Oxygen-free Copper (C1100)
- Pressure Drop
- Optimized < 20 kPa at nominal flow
- Max Pressure Rating
- Up to 10 bar test pressure (Helium leak tested)
- Cooling Media
- Water-Glycol mixture (PG20–50), Deionized Water, Dielectric Fluid
- Applications
- High-Performance Computing (HPC), IGBT Modules, E-Mobility, Inverters