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ALVC Aluminum Vapor Chamber
ALVC Aluminum Vapor Chamber
High-efficiency two-phase vapor chamber heat spreaders with lightweight aluminum construction. Designed for GPU, CPU, IGBT power electronics, and energy storage systems.
The ALVC Aluminum Vapor Chamber combines the extreme thermal conductivity of two-phase systems (5,000 to 10,000 W/(m·K)) with the ultra-low weight of aerospace-grade aluminum.
Compared to conventional copper vapor chambers, ALVC technology reduces weight by up to 60% with comparable heat spreading performance. This makes it the premier choice for automotive electronics, aerospace payloads, and high-density computing racks.
Technical Specifications & Performance
- Technology
- Two-phase Aluminum Vapor Chamber (AVC)
- Effective Thermal Conductivity
- 5,000 to 10,000 W/(m·K) (approx. 25x better than solid copper)
- Weight Reduction
- Up to 60% lighter than traditional copper vapor chambers
- Manufacturing Process
- Precision aluminum extrusion with Friction Stir Welding (FSW) seals
- Working Medium
- Eco-compatible fluids or high-purity acetone under high vacuum
- Leak Testing
- 100% Inline Helium Mass Spectrometry Leak Detection
- Target Markets
- Automotive, E-Mobility, Data Centers, HPC, Aerospace