
IGBT & Leistungselektronik
IGBT & Power Electronics Cooling
Inverters, traction drives, frequency converters, and high-power IGBT modules generate extreme localized heat flux densities under high switching frequencies. ALVC provides customized thermal management solutions (Vapor Chambers, Liquid Cold Plates, and Pin-Fin extrusions) engineered specifically for power semiconductors.
Through ultra-low junction-to-case thermal resistance (Rth,j-c) and uniform thermal spreading across the substrate, our systems significantly reduce thermal cycling stress. This maximizes switching reliability, increases current density, and extends the operational lifespan of IGBT power modules in industrial drives, e-mobility, and renewable energy inverters.
Related Products

ALVC Vapor Chamber
High-efficiency two-phase heat spreaders with lightweight aluminum construction. Designed for GPU, CPU, IGBT power electronics and energy storage systems.
Learn More
Liquid Cold Plate (LCP)
Custom Liquid Cold Plates (LCP). We master all manufacturing types and advise you on the most efficient solution for your project.
Learn More
Heat Sink
Extruded, milled, stacked and die-cast aluminum heat sinks with optional heat pipe integration – manufactured to drawing for power electronics, HPC and industrial drives.
Learn More
Copper Heat Pipe Assembly
High-performance assembly integrating custom copper heat pipes, aluminum fins, and precision baseplates for rapid localized heat transfer.
Learn More