3DVC Vapor Chamber Heat Sink
3DVC Vapor Chamber Heat Sink
Advanced three-dimensional vapor chamber heat sink combining horizontal and vertical two-phase cooling for ultra-high power densities in AI accelerators and power electronics.
3DVC (3D Vapor Chamber) technology represents the pinnacle of air-assisted phase-change thermal management. While conventional vapor chambers only spread heat two-dimensionally across the X-Y baseplate, 3DVC integrates vertical heat pipe columns directly into the unified hermetic vapor chamber cavity.
By eliminating contact thermal interface resistance between the base vapor chamber and vertical tubes, overall thermal resistance (Rth) drops by up to 35%. This enables reliable air cooling of high-TDP AI accelerators and server processors from 800W to over 1200W.
Technical Specifications & Performance
- Technology
- Seamless unified 3D Vapor Chamber architecture
- Effective Thermal Conductivity
- Up to 10,000 W/(m·K)
- Heat Dissipation Capability (TDP)
- 800W to > 1,200W air-cooled
- Thermal Contact Resistance
- Reduced by up to 35% versus conventional two-piece assemblies
- Core Materials
- High-purity Oxygen-Free Copper or ALVC Ultra-Light Aluminum
- Leak Testing
- 100% Mass Spectrometer Helium Leak Audited
- Applications
- AI Accelerator cards (GPU/TPU/ASIC), Hyperscale HPC, Traction Inverters