Passive 3D-Bent ALVC Frame Cooler for IGBT Modules: 25× Thermal Spreading with 0 W Pump Power

Why add complex liquid cooling loops to high-power IGBTs when passive two-phase air cooling can do the job?

A closed-loop Aluminum Vapor Chamber (ALVC) frame cooler offers a simpler, 100% passive alternative. Heat from the IGBT modules evaporates the working fluid inside the baseplate, vapor expands rapidly across the 3D-bent frame, and the condensate returns passively by gravity and capillary action to the heat source.

Key Engineering Specifications

• Up to 25× Thermal Spreading: Two-phase vapor expansion eliminates solid copper conduction bottlenecks at heat fluxes up to 80 W/cm².
• 0 W Parasitic Pumping Power: Purely passive phase change moves heat to the fins with zero electrical draw.
• Up to 60% Lower Weight: Extruded multi-chamber aluminum profile replaces heavy solid copper blocks.
• Structural & Sealing Integrity: Solid-state FSW closure with burst pressure > 35 bar (550 psi), machined base flatness < 0.1 mm, and through-hole mounting in sacrificed chambers keeping the active vapor core 100% intact.

Combining one closed-loop 3D-bent ALVC profile with three extruded aluminum fin heat sinks inside the frame and on the rear wall delivers an ultra-compact, maintenance-free thermal solution for traction inverters, solar/wind converters, HVDC, and industrial drives.

Technical Specs & Free STEP Feasibility Review: Explore ALVC Aluminum Vapor Chambers →