ALVC Vapor Chamber
High-efficiency two-phase heat spreaders with lightweight aluminum construction. Designed for GPU, CPU, IGBT power electronics and energy storage systems.
The ALVC Aluminum Vapor Chamber (AVC) is built on an advanced flat aluminum heat pipe structure (Micro-Port Extrusion MPE), delivering exceptional two-phase heat spreading efficiency even under high power density conditions. Designed to eliminate hotspots and enhance device reliability and service life.
Compared to traditional copper designs, the ALVC aluminum system offers significant weight savings while maintaining outstanding thermal performance with effective conductivities ranging from 5,000 to 10,000 W/(m·K). The fully integrated aluminum construction with precision-welded end caps guarantees zero leakage risk and high corrosion resistance.
Specifications
- Thermal Conductivity
- 5,000 ~ 10,000 W/(m·K)
- Operating Temperature
- -110 °C to +200 °C (Non-freezing fluid down to -110 °C)
- Weight Advantage
- Significant weight reduction vs. traditional copper
- Thickness Range
- 1.5 mm – 6.0 mm
- Width Range
- 20 mm – 300 mm
- Length Range
- 60 mm – 2,000 mm
- Min Bending Radius
- R3 – R8 (depending on thickness)
- Construction
- Integral aluminum, fully welded ends (Zero leakage)
- Customization
- Bendable shapes, direct contact mounting, custom CNC hole punching